Title:
PLATED MATERIAL AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/189901
Kind Code:
A1
Abstract:
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material 5 includes: a substrate 51 that includes one or more substrate metallic elements; and a plating layer 52 that is formed directly on the substrate 51. The plating layer 52 includes at least a first plating layer metallic element, and a second plating layer metallic element that is different from the first plating layer metallic element. The second plating layer metallic element is the same metallic element as at least one of the one or more substrate metallic elements. In a thickness direction of the plating layer 52, the proportion of the second plating layer metallic element in the plating layer 52 continuously decreases in accordance with greater distance away from the substrate 51, and/or no clear interface exists between the substrate 51 and the plating layer 52.
Inventors:
IIMORI MASAYUKI (JP)
TAKEDA RYOSUKE (JP)
TAKEDA RYOSUKE (JP)
Application Number:
PCT/JP2017/015365
Publication Date:
October 18, 2018
Filing Date:
April 14, 2017
Export Citation:
Assignee:
YKK CORP (JP)
International Classes:
C25D7/02; C25D3/56; C25D5/10; C25D17/16
Domestic Patent References:
| WO2013141166A1 | 2013-09-26 |
Foreign References:
| JP2002042556A | 2002-02-08 | |||
| JP2012087388A | 2012-05-10 | |||
| JP2014019953A | 2014-02-03 |
Other References:
AOTANI, KAORU ET AL., 1966, pages 176
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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