Title:
PLATED OBJECT WITH COPPER THIN FILM FORMED BY ELECTROLESS PLATING
Document Type and Number:
WIPO Patent Application WO/2010/016358
Kind Code:
A1
Abstract:
Disclosed is a plated object with a copper thin film formed by electroless plating that, when a seed layer is formed by electroless copper plating, for example, in damascene copper wiring, can improve evenness and adhesion of a formed film as compared with those of a film formed by electroless copper plating on a simple metal such as tungsten or molybdenum and further can eliminate the complexity of the formation of two layers of a barrier layer and a catalyst metal layer before the formation of the copper seed layer to form a seed layer having a small and even thickness that can realize the formation of ultrafine wiring.
The plated object is characterized by comprising a thin film of a barrier alloy, for copper diffusion prevention purposes, provided on a base material, the thin film of the barrier alloy comprising a metal B that can realize displacement plating with copper ions contained in an electroless copper plating liquid and has copper barrier properties and a metal A that has a lower ionization tendency in an electroless copper plating liquid having a pH value of 10 or more than the metal B, the thin film of the barrier alloy having a metal A content of not less than 15 atom% and not more than 35 atom%, the plated object further comprising a copper thin film provided on the thin film of the barrier alloy, the copper thin film having been formed by electroless plating using an electroless copper plating liquid having a pH value of 10 or more.
Inventors:
ITO JUNICHI (JP)
YABE ATSUSHI (JP)
SEKIGUCHI JUNNOSUKE (JP)
IMORI TORU (JP)
YAMAKOSHI YASUHIRO (JP)
SENDA SHINICHIRO (JP)
YABE ATSUSHI (JP)
SEKIGUCHI JUNNOSUKE (JP)
IMORI TORU (JP)
YAMAKOSHI YASUHIRO (JP)
SENDA SHINICHIRO (JP)
Application Number:
PCT/JP2009/062662
Publication Date:
February 11, 2010
Filing Date:
July 13, 2009
Export Citation:
Assignee:
NIPPON MINING CO (JP)
ITO JUNICHI (JP)
YABE ATSUSHI (JP)
SEKIGUCHI JUNNOSUKE (JP)
IMORI TORU (JP)
YAMAKOSHI YASUHIRO (JP)
SENDA SHINICHIRO (JP)
ITO JUNICHI (JP)
YABE ATSUSHI (JP)
SEKIGUCHI JUNNOSUKE (JP)
IMORI TORU (JP)
YAMAKOSHI YASUHIRO (JP)
SENDA SHINICHIRO (JP)
International Classes:
C23C18/38; C23C28/02
Domestic Patent References:
| WO2005038086A1 | 2005-04-28 |
Foreign References:
| JP2002302773A | 2002-10-18 | |||
| JP2002275639A | 2002-09-25 | |||
| JP2008223100A | 2008-09-25 |
Other References:
See also references of EP 2309025A4
Attorney, Agent or Firm:
SAKAI, Masami et al. (JP)
Masami Sakai (JP)
Masami Sakai (JP)
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