PLATEN ASSEMBLY HAVING A TOPOGRAPHICALLY ALTERED PLATEN SURFACE

Title:

PLATEN ASSEMBLY HAVING A TOPOGRAPHICALLY ALTERED PLATEN SURFACE

Document Type and Number:

WIPO Patent Application WO/2003/013788

Kind Code:

A1

Abstract:

An apparatus for improving performance of a wafer polishing apparatus (10) is described. The apparatus includes a platen in a support assembly (28) having a plurality of fluid channels (34) and at least one region of altered topography (52) positioned on a portion of the platen (30) surface.

Inventors:

TAYLOR TRAVIS R
XU CANGSHAN
CROFTON KEVIN T
ZHAO EUGENE YUEXING

Application Number:

PCT/US2002/024272

Publication Date:

February 20, 2003

Filing Date:

July 31, 2002

Export Citation:

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Assignee:

LAM RES CORP (US)

International Classes:

B24B7/04; B24B21/06; B24B37/16; (IPC1-7): B24B21/06; B24B37/04

Foreign References:

EP0914906A2	1999-05-12
US6000997A	1999-12-14
US20020081947A1	2002-06-27

Attorney, Agent or Firm:

Heffner, Anastasia (P.O. Box 10087 Chicago, IL, US)

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