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Title:
PLATING ADHESION EVALUATION DEVICE, PLATING ADHESION EVALUATION METHOD, EQUIPMENT FOR MANUFACTURING ALLOYED HOT-DIP GALVANIZED STEEL SHEET, AND METHOD FOR MANUFACTURING ALLOYED HOT-DIP GALVANIZED STEEL SHEET
Document Type and Number:
WIPO Patent Application WO/2019/069832
Kind Code:
A1
Abstract:
Provided are a plating adhesion evaluation device, a plating adhesion evaluation method, equipment for manufacturing an alloyed hot-dip galvanized steel sheet, and a method for manufacturing an alloyed hot-dip galvanized sheet, with which it is possible to more accurately measure the quantity of a Γ·Γ single phase and to more accurately evaluate the plating adhesion of an alloyed hot-dip galvanized steel sheet. [Problem] A plating adhesion evaluation device according to the present invention comprises: an X-ray diffraction intensity measurement unit that measures the intensity of X-ray diffraction of a Γ·Γ single phase through an X-ray diffraction method with respect to an alloyed hot-dip galvanized steel sheet; and an evaluation unit that, on the basis of the X-ray diffraction intensity of the Γ·Γ single phase and the galvanization weight, evaluates the plating adhesion of the alloyed hot-dip galvanized steel sheet.

Inventors:
HASHIMOTO SHIGERU (JP)
HARADA TAKESHI (JP)
OKAZAKI JUNYA (JP)
TOKI TAMOTSU (JP)
Application Number:
PCT/JP2018/036502
Publication Date:
April 11, 2019
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
G01N23/20; C23C2/06; C23C2/28; C23C2/40
Domestic Patent References:
WO2015059835A12015-04-30
Foreign References:
JPS61148355A1986-07-07
JP2015175040A2015-10-05
KR100489298B12005-05-17
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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