PLATING APPARATUS, PLATING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Title:

PLATING APPARATUS, PLATING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2003/050328

Kind Code:

A1

Abstract:

Problem: It has been desired to form a plurality of combinations of plating films continuously on a single transfer rail and to form a plating film having a high quality and a uniform thickness on the surfaces of a lead frame and leads. Solving Means: The plating apparatus is provided below the single transfer rail with a plurality of plating tanks, in which plating solution baths are disposed. By moving the plating solution between the plating tanks and the plating solution baths, it is possible to select a plating film to be formed on a conductive member (21). As a result, it is possible to form combinations of plating films on the conductive member (21) continuously by the single transfer rail.

Inventors:

KAMEYAMA KOUJIRO (JP)

Application Number:

PCT/JP2001/010873

Publication Date:

June 19, 2003

Filing Date:

December 12, 2001

Export Citation:

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Assignee:

SANYO ELECTRIC CO (JP)
KAMEYAMA KOUJIRO (JP)

International Classes:

C25D5/10; C25D7/12; C25D17/00; C25D17/08; C25D17/10; C25D17/28; C25D19/00; C25D21/00; H01L23/495; H01L23/50; (IPC1-7): C25D7/00; C25D7/12; C25D17/00; C25D17/08; C25D19/00; H01L23/50

Foreign References:

JP2001234389A	2001-08-31
JPH11330340A	1999-11-30
JP2001271200A	2001-10-02
JP2001234390A	2001-08-31
JP2001254199A	2001-09-18

Other References: