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Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/150657
Kind Code:
A1
Abstract:
The present invention prevents degradation of uniformity of the thickness of a plating film due to organic material adhering to an edge section of a substrate and/or an oxide film formed on the edge section of the substrate. A plating apparatus for plating a substrate is provided. This plating apparatus has a plating bath for applying a voltage to a substrate set in a substrate holder and plating the substrate, and an edge section washing device for locally removing an organic material and/or an oxide film present on an edge section of the substrate before the substrate is set in the substrate holder.

Inventors:
NAGAI, Mizuki (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
SHIMOYAMA, Masashi (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
KISHI, Takashi (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
NISHIURA, Fumitoshi (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
Application Number:
JP2017/008256
Publication Date:
September 08, 2017
Filing Date:
March 02, 2017
Export Citation:
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Assignee:
EBARA CORPORATION (11-1, Haneda Asahi-cho Ohta-k, Tokyo 10, 〒1448510, JP)
International Classes:
C25D17/00; C23G1/02; C25D5/34; C25D7/12; C25D17/06; H01L21/288
Domestic Patent References:
WO2001099168A12001-12-27
Foreign References:
JP2005019802A2005-01-20
JP2008112772A2008-05-15
JPH0794450A1995-04-07
JPH05160105A1993-06-25
JP2014216393A2014-11-17
JP2004076022A2004-03-11
Attorney, Agent or Firm:
ONO, Shinjiro et al. (YUASA AND HARA, Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
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