PLATING APPARATUS AND PLATING METHOD

WIPO Patent Application WO/2017/217216

A1

To suppress variation in the thickness of a plating film formed by a plating treatment. A plating apparatus 100 is provided with a plating tank 10, and a plating unit 20 for carrying out electrolytic plating on an object to be plated 2. The plating unit 20 is provided with: an object to be plated passage region 23 through which the object to be plated 2 passes downward from above, and at least a portion of which is enclosed by a partition wall 22 that allows a plating solution 1, but not the object to be plated 2, to pass therethrough; a spraying unit 24 for spraying the plating solution 1 upward from below; a mixing unit 25 for mixing the plating solution 1 that was sprayed by the spraying unit 24 and the object to be plated 2 that passed through the object to be plated passage region 23; an anode 21 disposed outside of the object to be plated passage region 23; a cathode 23 disposed inside of the object to be plated passage region 23, and having a hollow region 26a through which a mixed fluid 3 comprising the plating solution 1 and the object to be plated 2 passes upward from below; and a guidance unit 27 for guiding the mixed fluid 3 that passed through the hollow region 26a to the object to be plated passage region 23.

HOSOKAWA TAKAO (JP)

PCT/JP2017/019748

December 21, 2017

May 26, 2017

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MURATA MANUFACTURING CO (JP)

C25D17/28; C25D17/00; C25D17/16; C25D21/10

JP2007051378A	2007-03-01
JP2007191726A	2007-08-02
JP2017095787A	2017-06-01

NISHIZAWA, Hitoshi et al. (JP)

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