Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/107339
Kind Code:
A1
Abstract:
The present invention relates to a plating apparatus and plating method for partially forming a plating film on an object to be plated. The plating apparatus is provided with: a rotary electrode capable of rotational operation; a plating liquid retaining part for retaining a plating liquid, the plating liquid retaining part being provided to the rotary electrode; and a power source part for applying a voltage between a part to be plated and the rotary electrode.
More Like This:
| WO/1996/002687 | ELECTROLYTIC PLATING APPARATUS AND METHOD |
Inventors:
TAKEMOTO YOHEI (JP)
AKAMI YUTAKA (JP)
AKAMI YUTAKA (JP)
Application Number:
PCT/JP2018/043519
Publication Date:
June 06, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C25D5/04; C25D5/02; C25D5/18; C25D17/12
Foreign References:
| JPH04180590A | 1992-06-26 | |||
| JP2005264281A | 2005-09-29 | |||
| JP2009228121A | 2009-10-08 | |||
| JP2010095775A | 2010-04-30 | |||
| JP2008202139A | 2008-09-04 | |||
| JPH02170997A | 1990-07-02 |
Other References:
See also references of EP 3719179A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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