Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/189181
Kind Code:
A1
Abstract:
The present invention discloses plating apparatuses and plating methods for metal deposition on a substrate with pattern structures. In an embodiment, a plating apparatus comprises a plating bath configured to accommodate electrolyte, a substrate holding module configured to hold a substrate, and at least one driving device configured to drive the substrate holding module together with the substrate to horizontally vibrate and/or vertically vibrate during the substrate being immersed into the electrolyte to be plated. The present invention can enhance mass transfer during the substrate being plated by vibrating the substrate holding module so as to raise plating rate and uniformly plating on the pattern structures.
Inventors:
WANG HUI (CN)
WANG JIAN (CN)
YANG HONGCHAO (CN)
JIA ZHAOWEI (CN)
WANG JIAN (CN)
YANG HONGCHAO (CN)
JIA ZHAOWEI (CN)
Application Number:
PCT/CN2020/080622
Publication Date:
September 30, 2021
Filing Date:
March 23, 2020
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
C25D17/00; C25D7/12; C25D17/06
Domestic Patent References:
| WO2012174732A1 | 2012-12-27 | |||
| WO1999054527A2 | 1999-10-28 |
Foreign References:
| CN105986290A | 2016-10-05 | |||
| CN105190859A | 2015-12-23 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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