Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/238572
Kind Code:
A1
Abstract:
The present invention relates to a plating apparatus and a plating method, by each of which at least one main surface of a rectangular substrate is plated. A plating apparatus according to the present invention is provided with: a process tank in which a plating liquid is retained; an anode electrode which is in contact with the plating liquid in the process tank; and a substrate holding unit which holds a substrate in a horizontal posture with one main surface facing up within the process tank. The substrate holding unit has a plurality of chuck mechanisms, each of which is provided with a cathode electrode and holds the substrate, while having the cathode electrode in contact with the one main surface of the substrate; and at least one chuck mechanism is arranged on each one of two sides, which face each other, among the sides of the substrate. Consequently, even a large substrate can be held in an appropriate posture and a uniform plating film can be obtained.
Inventors:
KINUNO ATSUSHI (JP)
NISHIKIUCHI HISASHI (JP)
NISHIKIUCHI HISASHI (JP)
Application Number:
PCT/JP2023/017381
Publication Date:
December 14, 2023
Filing Date:
May 09, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
C25D17/06; C25D7/00; C25D17/00; C25D17/08; C25D21/10; C25D21/12
Foreign References:
| JP2008545883A | 2008-12-18 | |||
| JP2002523626A | 2002-07-30 | |||
| JP2001323399A | 2001-11-22 | |||
| JP2011068492A | 2011-04-07 | |||
| JP2017008346A | 2017-01-12 | |||
| US20200208288A1 | 2020-07-02 | |||
| JP2021514425A | 2021-06-10 | |||
| JP2001514333A | 2001-09-11 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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