PLATING APPARATUS AND SENSING DEVICE USING SAME

Title:

PLATING APPARATUS AND SENSING DEVICE USING SAME

Document Type and Number:

WIPO Patent Application WO/2015/025693

Kind Code:

A1

Abstract:

Provided are: a plating apparatus which is simpler than conventional plating apparatuses and can be easily reduced in size; and a sensing device which uses this plating apparatus. A plating apparatus (1) is provided with: a holding member (2) for holding an object to be plated (W); a spacer (4) which is laminated on the holding member (2) with an annular first sealing member (3) being interposed therebetween, said first sealing member (3) surrounding the object to be plated (W), and which has a penetration part (45) that has the object to be plated (W) exposed therethrough and retains a plating liquid therein; and a positive electrode member (6) which is laminated on the spacer (4) with an annular second sealing member (5) that surrounds the penetration part (45) being interposed therebetween, and which has a positive electrode layer (62) that is arranged so as to face the object to be plated (W) exposed from the penetration part (45).

Inventors:

YAMAMOTO WATARU (JP)
KOIWA KIMIKO (JP)
HOMMA TAKAYUKI (JP)
YANAGISAWA MASAHIRO (JP)
SAITO MIKIKO (JP)
YAMAMOTO TOMOYUKI (JP)

Application Number:

PCT/JP2014/070252

Publication Date:

February 26, 2015

Filing Date:

July 31, 2014

Export Citation:

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Assignee:

YAMAMOTO MS CO LTD (JP)
UNIV WASEDA (JP)

International Classes:

C25D17/08; C23C18/31; C25D21/12

Foreign References:

JPH11195622A	1999-07-21
JPH11335895A	1999-12-07
JP2009287093A	2009-12-10
JP2013119648A	2013-06-17
JP2012241236A	2012-12-10
JP2008076143A	2008-04-03
US4151049A	1979-04-24
JP2006299367A	2006-11-02

Other References: