PLATING APPARATUS

WIPO Patent Application WO2004081261

A3

The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186). A ring-shaped nozzle pipe (220) having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186), or a stirring mechanism having a stirring vane are disposed in the plating tank (186).

KURIYAMA FUMIO (JP)
TAKEMURA TAKASHI (JP)
SAITO NOBUTOSHI (JP)
KIMURA MASAAKI (JP)
KIUMI REI (JP)

PCT/JP2004/003040

May 26, 2005

March 09, 2004

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EBARA CORP (JP)
KURIYAMA FUMIO (JP)
TAKEMURA TAKASHI (JP)
SAITO NOBUTOSHI (JP)
KIMURA MASAAKI (JP)
KIUMI REI (JP)

C23C18/16; C23C18/54; C25D5/02; C25D5/08; C25D7/12; C25D17/00; C25D21/10; H01L21/288; H01L21/60; (IPC1-7): H01L21/288; C23C18/54; C25D5/02; C25D5/08; C25D7/12

EP1167583A2	2002-01-02
EP1174912A1	2002-01-23
US5421987A	1995-06-06
US20020027080A1	2002-03-07
US6071388A	2000-06-06
US20030153185A1	2003-08-14
US5683564A	1997-11-04

PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26)

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