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Title:
PLATING CHUCK
Document Type and Number:
WIPO Patent Application WO/2019/047086
Kind Code:
A1
Abstract:
A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.

Inventors:
WANG HUI (CN)
WANG JIAN (CN)
JIA ZHAOWEI (CN)
YANG HONGCHAO (CN)
Application Number:
PCT/CN2017/100814
Publication Date:
March 14, 2019
Filing Date:
September 07, 2017
Export Citation:
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Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
C25D7/12
Foreign References:
CN107012495A2017-08-04
CN106337198A2017-01-18
TW541597B2003-07-11
US6398926B12002-06-04
US20040035712A12004-02-26
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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