PLATING DEVICE, PLATING METHOD, AND METHOD FOR PRODUCING WIRE MATERIAL HAVING PLATED SURFACE

WIPO Patent Application WO/2022/039060

A1

Provided is a plating device for producing a highly precise plating layer. This plating device (10) is provided with a plating vessel (9), cathodes (1a to 1f), a holding mechanism (2), an anode (3), and a rotation mechanism (4). In the plating vessel (9), a material to be plated (90) which is wound circularly or spirally is placed together with a plating solution. The cathodes (1a to 1f) are arranged in the plating vessel (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions at which the cathodes (1a to 1f) are electrically connected to the outer peripheral side of the material to be plated (90), and also holds the material to be plated (90) through the cathodes (1a to 1f). The anode (3) is arranged on at least the inner peripheral side of the material to be plated (90) that is held by the holding mechanism (2). The rotation mechanism (4) rotates the material to be plated (90) and the cathodes (1a to 1f) which are held by the holding mechanism (2) and/or the anode (3) about the axis of the material to be plated (90).

WO/2021/220524	COMPOSITE COPPER MEMBER
JPH093691	PLATING DEVICE

NAKAMURA TAKASHI (JP)
KAWAWAKI TAKUYA (JP)
TERASHITA MITSUHIKO (JP)
HIRAKAMI MASAHIKO (JP)
HOJO MASAFUMI (JP)
NAKAMURA RYOSUKE (JP)
ISHIKAWA MASAO (JP)
NISHIKAWA TAKETO (JP)
RYO TOSHIHIKO (JP)

PCT/JP2021/029413

February 24, 2022

August 06, 2021

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TEIKOKU ION CO LTD (JP)
NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECH (JP)
OKAZAKI MFG COMPANY (JP)

C25D7/06; C25D17/08; C25D17/12; C25D21/00

JP2004027366A	2004-01-29
JP2015071816A	2015-04-16
JP2010519413A	2010-06-03

SAEGUSA & PARTNERS (JP)

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