Title:
PLATING DEVICE FOR PRINTED CIRCUIT BOARD AND METAL TOOLS
Document Type and Number:
WIPO Patent Application WO/2019/035236
Kind Code:
A1
Abstract:
A printed circuit board plating device, comprising: a plating tank for retaining a plating solution; a plurality of metal tools; an anode provided opposite a printed-circuit-board substrate; and a mechanism for applying voltage to the anode and the printed-circuit-board substrate, wherein the plurality of metal tools include an insulative shielding plate in a region opposite the anode and include, on the printed-circuit-board substrate side and between the printed-circuit-board substrate and the shielding plate, an exposed surface that is orthogonal to the printed-circuit-board substrate.
Inventors:
MOTOMURA JUNICHI (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
MATSUMOTO MASAHIRO (JP)
ITOH MASAHIRO (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
MATSUMOTO MASAHIRO (JP)
ITOH MASAHIRO (JP)
Application Number:
PCT/JP2018/010724
Publication Date:
February 21, 2019
Filing Date:
March 19, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
C25D17/08; C25D7/00; C25D17/06; C25D17/10; H05K3/18
Foreign References:
| JPH08296092A | 1996-11-12 | |||
| JP2009041070A | 2009-02-26 | |||
| JP3154267U | 2009-10-15 | |||
| JP2013129911A | 2013-07-04 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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