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Patent Searching and Data


Title:
PLATING DEVICE FOR PRINTED CIRCUIT BOARD AND METAL TOOLS
Document Type and Number:
WIPO Patent Application WO/2019/035236
Kind Code:
A1
Abstract:
A printed circuit board plating device, comprising: a plating tank for retaining a plating solution; a plurality of metal tools; an anode provided opposite a printed-circuit-board substrate; and a mechanism for applying voltage to the anode and the printed-circuit-board substrate, wherein the plurality of metal tools include an insulative shielding plate in a region opposite the anode and include, on the printed-circuit-board substrate side and between the printed-circuit-board substrate and the shielding plate, an exposed surface that is orthogonal to the printed-circuit-board substrate.

Inventors:
MOTOMURA Junichi (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
NITTA Koji (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
SAKAI Shoichiro (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
MATSUMOTO Masahiro (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
ITOH Masahiro (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
Application Number:
JP2018/010724
Publication Date:
February 21, 2019
Filing Date:
March 19, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Koka-sh, Shiga 68, 〒5280068, JP)
International Classes:
C25D17/08; C25D7/00; C25D17/06; C25D17/10; H05K3/18
Foreign References:
JPH08296092A1996-11-12
JP2009041070A2009-02-26
JP3154267U2009-10-15
JP2013129911A2013-07-04
Attorney, Agent or Firm:
NAKATA Motomi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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