PLATING DEVICE

WIPO Patent Application WO/2011/027528

A1

Disclosed is a plating device which makes it possible to effectively form a plated layer of uniform thickness on base particles having an electrically conductive surface. The plating device is a device for plating base particles having an electrically conductive surface, which comprises: a plating tank having a plating chamber provided with a bottom surface which can circulate while the base particles come into contact therewith and a peripheral wall surface standing upright along the peripheral edge of the bottom surface, and which can house a particle group containing the base particles and plating liquid; a plating liquid supply pipe which has a supply port that opens upwards from the bottom surface of the plating chamber, and which supplies the plating liquid from the supply port in such a way that said plating liquid swirls around the peripheral wall surface of the plating chamber; a plating liquid discharge pipe which has a discharge port that opens into the plating chamber; a negative electrode which comes into contact with the base particles disposed on the bottom surface of the plating chamber; a positive electrode which is disposed at a position immersed in the plating liquid housed in the plating chamber; and a power source which is connected to the negative electrode and positive electrode.

ITOH MOTOYUKI (JP)
TAKEDA KYOKO (JP)
HAYAKAWA HAJIME (JP)

PCT/JP2010/005307

March 10, 2011

August 27, 2010

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HITACHI METALS LTD (JP)
ITOH MOTOYUKI (JP)
TAKEDA KYOKO (JP)
HAYAKAWA HAJIME (JP)

C25D17/18; C25D7/00

JP2006509108A	2006-03-16
JP2002322591A	2002-11-08
JPH06116795A	1994-04-26
JPS58100698A	1983-06-15

SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)

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