Title:
PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/105420
Kind Code:
A1
Abstract:
Disclosed is a plating device (1) that has a plating tank (3) that retains a plating fluid (2) and carries out magnetic metal plating on a shaft shaped member (5) immersed in the plating fluid (2) as a negative electrode. The plating device (1) is provided with: a plurality of shielding jigs (13, 14, 15) that are fitted to the outer peripheral surface of the shaft shaped member (5) and regulate the part (5s) of the shaft shaped member (5) being plated; and a positive electrode (10) provided in the vicinity of the shaft shaped member (5) and having an output part (10s) that faces the part (5s) being plated. A center position (5c) in the axial direction (J) of the shaft shaped member (5) for the part (5s) being plated and a center position (10c) of the output part (10s) are aligned within a prescribed allowable value for the center positions.
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Inventors:
ARIMURA YUTAKA (JP)
SHIMIZU YASUO (JP)
YONEDA ATSUHIKO (JP)
SHIMIZU YASUO (JP)
YONEDA ATSUHIKO (JP)
Application Number:
PCT/JP2012/083272
Publication Date:
July 18, 2013
Filing Date:
December 21, 2012
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
C25D17/10; C25D7/00; C25D17/00; C25D21/00
Domestic Patent References:
| WO2008047509A1 | 2008-04-24 |
Foreign References:
| JP2005003622A | 2005-01-06 | |||
| JPS4627281B1 | ||||
| JP2002523625A | 2002-07-30 |
Attorney, Agent or Firm:
SHIMODA, Yo-ichiro et al. (JP)
Yoichiro Shimoda (JP)
Yoichiro Shimoda (JP)
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Claims: