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Patent Searching and Data


Title:
PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/123059
Kind Code:
A1
Abstract:
Provided is a plating device which, during a haring cell test or the like, can prevent disorder in a current distribution and deviation in a pair of negative electrode potentials. This plating device (1) is provided with: a positive electrode (12) and a pair of negative electrodes (13X, 13Y), which are provided in a plating bath (11); a plating power source (14) for causing a plating current to flow between the positive electrode (12) and the pair of negative electrodes (13X, 13Y); and a feedback circuit (21) that ensures that the potential of one negative electrode (13X) matches the potential of the other negative electrode (13Y) in a state in which the sum of the currents that flow in the pair of negative electrodes (13X, 13Y) is maintained constant.

Inventors:
YAMAMOTO WATARU (JP)
KOIWA KIMIKO (JP)
AKIYAMA KATSUNORI (JP)
ISHIGURO MASAZUMI (JP)
HOSHINO YOSHIAKI (JP)
Application Number:
PCT/JP2016/089200
Publication Date:
July 05, 2018
Filing Date:
December 28, 2016
Export Citation:
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Assignee:
YAMAMOTO MS CO LTD (JP)
International Classes:
C25D21/00; C25D21/12
Foreign References:
JPH06109611A1994-04-22
JP2002302798A2002-10-18
JP2004269953A2004-09-30
JP2006199994A2006-08-03
JP2006342403A2006-12-21
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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