Title:
PLATING FILM AND PLATING FILM PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/270253
Kind Code:
A1
Abstract:
The present invention provides a plating film that exhibits excellent adhesion with respect to a glass substrate. The plating film according to the present invention is characterized by having an oxide layer, an electroless plating film, and an electrolytic copper plating film in the stated order.
Inventors:
TSUKUDA MAYU (JP)
NAGAO TOSHIMITSU (JP)
KATAYAMA JUNICHI (JP)
SHIMADA KAZUYA (JP)
HAYAMIZU MASAHITO (JP)
SAKATA TOSHIHIKO (JP)
FUKU SHUHEI (JP)
HIROOKA ASUKA (JP)
NAGAO TOSHIMITSU (JP)
KATAYAMA JUNICHI (JP)
SHIMADA KAZUYA (JP)
HAYAMIZU MASAHITO (JP)
SAKATA TOSHIHIKO (JP)
FUKU SHUHEI (JP)
HIROOKA ASUKA (JP)
Application Number:
PCT/JP2022/022268
Publication Date:
December 29, 2022
Filing Date:
June 01, 2022
Export Citation:
Assignee:
OKUNO CHEM IND CO (JP)
PANASONIC HOLDINGS CORP (JP)
PANASONIC HOLDINGS CORP (JP)
International Classes:
C23C18/18; C23C18/20; C23C18/32; C23C18/36; C23C18/38; C23C18/40; H05K3/18; H05K3/38
Domestic Patent References:
| WO2019188843A1 | 2019-10-03 | |||
| WO2005038086A1 | 2005-04-28 |
Foreign References:
| JPH08144061A | 1996-06-04 | |||
| JP2001032086A | 2001-02-06 | |||
| JP2015509146A | 2015-03-26 | |||
| JPH07309638A | 1995-11-28 | |||
| JP6917587B1 | 2021-08-11 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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