Title:
PLATING JIG FOR HARD DISK SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/203212
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a plating jig for a hard disk substrate, capable of supporting the hard disk substrate in a stable orientation and suppressing flapping of the hard disk substrate during plating of the hard disk substrate. This plating jig 10 for the hard disk substrate P is to be inserted into a through-hole h of the hard disk substrate P having the through-hole h at the center thereof and is provided with a groove 30 for supporting the hard disk substrate P during plating. The groove 30 is formed in a predetermined width W2 in an orthogonal direction to the axial direction of the plating jig 10 and to a predetermined depth DP2 and is formed in such a manner that the difference (clearance C (W2 - t)) between the thickness t of the hard disk substrate P and the width W2 of the groove 30 is 0.04 mm to 0.3 mm in a state in which the hard disk substrate P is supported by the groove 30.
Inventors:
MUKAI NOBUAKI (JP)
OOI SATOSHI (JP)
OOI SATOSHI (JP)
Application Number:
PCT/JP2019/016258
Publication Date:
October 24, 2019
Filing Date:
April 16, 2019
Export Citation:
Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
C23C18/31; G11B5/84
Foreign References:
| JPH06306621A | 1994-11-01 | |||
| JP2011231347A | 2011-11-17 | |||
| JPS63100614A | 1988-05-02 |
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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