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Patent Searching and Data


Title:
PLATING JIG
Document Type and Number:
WIPO Patent Application WO/2015/199047
Kind Code:
A1
Abstract:
 To provide a plating jig with which it is possible to facilitate loading and unloading of a wafer, and in which a plating solution is less likely to remain in the interior thereof. The plating jig (10) according to the present invention is provided with: a holding base (12) having a holding base body (121) brought into contact with one surface of a wafer (7), which is a substrate to be plated, and a plurality of latching parts (122) which are movable parallel to the surface of the wafer (7), independent from the holding base body (121); and a covering member (13) having a covering member body (131) brought into contact with the outer edge of the other surface of the wafer (7), and a plurality of latched parts (132) protruding outwards from the covering member body (131). The latching parts (122) are moved and caused to latch the latched parts (132), and the wafer (7) is held by being clamped between the holding base (12) and the covering member (13).

Inventors:
AKINO Takashi (10-1,Higashikotari 1-chome,Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
ARAI Kei (10-1,Higashikotari 1-chome,Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
YAMANE Shigeki (10-1,Higashikotari 1-chome,Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
NAKAJIMA Wataru (10-1,Higashikotari 1-chome,Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
NAKAYAMA Naoki (10-1,Higashikotari 1-chome,Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2015/067951
Publication Date:
December 30, 2015
Filing Date:
June 23, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD. (10-1, Higashikotari 1-chomeNagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
C25D17/08; C25D7/12; C25D17/06
Domestic Patent References:
WO2001068952A12001-09-20
Foreign References:
JP2006233296A2006-09-07
JP2000150421A2000-05-30
JP2012107311A2012-06-07
JP2004052059A2004-02-19
US20090245983A12009-10-01
US8236151B12012-08-07
Attorney, Agent or Firm:
FUKUNAGA Masaya (5FDaido-Seimei Esaka No.2 Building,23-5,Esaka-cho 1-chome,Suita-sh, Osaka 63, 〒5640063, JP)
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