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Title:
PLATING LEVELER FOR ELECTRODEPOSITION OF COPPER PILLAR
Document Type and Number:
WIPO Patent Application WO/2017/113439
Kind Code:
A1
Abstract:
Provided are a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.

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JPH01219187COPPER ELECTROPLATING SOLUTION
JP5365296Wet plating method and wet plating equipment
WO/1982/000666METHOD FOR CONTINUOUS METAL DEPOSITION FROM A NON-AUTOCATALYTIC ELECTROLESS PLATING BATH USING ELECTRIC POTENTIAL
Inventors:
SUN YAOFENG (CN)
XU MINJIE (CN)
LAO SHUN YEE (CN)
YAU SHU KIN (BN)
Application Number:
PCT/CN2016/070766
Publication Date:
July 06, 2017
Filing Date:
January 13, 2016
Export Citation:
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Assignee:
HONG KONG APPLIED SCIENCE & TECH RES INST COMPANY LTD (CN)
International Classes:
C25D3/38; C07C217/12; C07D295/00
Domestic Patent References:
WO2006094755A12006-09-14
Foreign References:
US20060016693A12006-01-26
CA1108087A1981-09-01
US4555315A1985-11-26
Attorney, Agent or Firm:
CHINA TRUER IP (CN)
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