Title:
PLATING MATERIAL AND ELECTRICAL AND ELECTRONIC COMPONENT USING THE PLATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2007/097338
Kind Code:
A1
Abstract:
Provided is a plating material (5) wherein a base layer (2) composed of Ni or the
like is arranged on a conductive base body (1), an intermediate layer (3) composed
of copper or a copper alloy is arranged on the base layer, and an outermost layer
(4) composed of a Cu-Sn intermetallic compound is arranged on the intermediate
layer. An electrical and electronic component using such material is also provided.
Inventors:
YOSHIDA KAZUO (JP)
SUSAI KYOTA (JP)
SUSAI KYOTA (JP)
Application Number:
PCT/JP2007/053099
Publication Date:
August 30, 2007
Filing Date:
February 20, 2007
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
YOSHIDA KAZUO (JP)
SUSAI KYOTA (JP)
YOSHIDA KAZUO (JP)
SUSAI KYOTA (JP)
International Classes:
C25D7/00; C22C9/02; C25D5/12; C25D5/50; H01R13/03
Foreign References:
| JP2005307240A | 2005-11-04 | |||
| JP2004300524A | 2004-10-28 | |||
| JP2005105419A | 2005-04-21 | |||
| JP2006042834A | 2006-02-16 | |||
| JP2007038697A | 2007-02-15 |
Other References:
See also references of EP 1995356A4
Attorney, Agent or Firm:
IIDA, Toshizo (1-10 Shimbashi 3-chome, Minato-k, Tokyo 04, JP)
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