Title:
PLATING METHOD AND PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/028973
Kind Code:
A1
Abstract:
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction, the plating method including: a step for rotating the substrate holder at a first rotation speed in a state in which the substrate holder is inclined; a step for discharging a liquid towards the substrate holder rotating at the first rotation speed so that the liquid is fed to the contact member; a step for stopping the discharging of the liquid; a step for beginning, before or within a prescribed time after the discharging of the liquid is stopped, to reduce the incline of the substrate holder towards a horizontal position; a step for rotating the substrate holder at a second rotation speed higher than the first rotation speed, in a state in which the substrate holder is in the horizontal position; and a step for performing the plating process on the substrate after the substrate has been mounted on the substrate holder.
Inventors:
TSUJI KAZUHITO (JP)
YAMAMOTO KENTARO (JP)
YAMAMOTO KENTARO (JP)
Application Number:
PCT/JP2022/029628
Publication Date:
February 08, 2024
Filing Date:
August 02, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D7/12; C25D21/00; C25D17/06
Foreign References:
| JP7047200B1 | 2022-04-04 | |||
| JP6934127B1 | 2021-09-08 | |||
| JP7089133B1 | 2022-06-21 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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