Title:
PLATING METHOD, PLATING DEVICE, AND NON-VOLATILE STORAGE MEDIUM IN WHICH PROGRAM IS STORED
Document Type and Number:
WIPO Patent Application WO/2020/250650
Kind Code:
A1
Abstract:
A method for performing plating, the method including: a step in which a substrate having different patterns on a first surface and a second surface thereof is prepared; a plating step in which currents having a first plating current density and a second plating current density are supplied to the first surface and the second surface of the substrate, respectively, and respective plating films are formed on the first surface and the second surface; and a step in which, after plating of either of the first surface and the second surface has been completed first, a protective current is supplied to the surface for which the plating was completed first, the protective current having a current density less than the first plating current density or the second plating current density that was supplied during plating of the surface for which the plating was completed first.
More Like This:
Inventors:
NAGAI MIZUKI (JP)
TAKAHASHI NAOTO (JP)
TAKAHASHI NAOTO (JP)
Application Number:
PCT/JP2020/020492
Publication Date:
December 17, 2020
Filing Date:
May 25, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D7/12; C25D21/12; H01L21/288
Foreign References:
| JPS57207192A | 1982-12-18 | |||
| JPS6475697A | 1989-03-22 | |||
| JP2005097721A | 2005-04-14 | |||
| JP2011089157A | 2011-05-06 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
Download PDF: