Title:
PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/235406
Kind Code:
A1
Abstract:
The present invention provides a plating method whereby consumption of an additive in a plating solution can be suppressed during plating of a substrate having a via or hole for forming a through electrode, and provides an insoluble anode and a plating device. The plating method includes a step for preparing a substrate having a via or hole for forming a through electrode, a step for preparing a plating solution tank in which an anode tank in which an insoluble anode is disposed and a cathode tank in which the substrate is disposed are divided by a diaphragm, and a step for electroplating the substrate so that the anode current density during plating of the substrate in the plating solution tank is 0.4 ASD to 1.4 ASD.
Inventors:
KANDA HIROYUKI (JP)
SHIMOMURA NAOKI (JP)
NAGAI MIZUKI (JP)
YASUDA SHINGO (JP)
OWATARI AKIRA (JP)
SHIMOMURA NAOKI (JP)
NAGAI MIZUKI (JP)
YASUDA SHINGO (JP)
OWATARI AKIRA (JP)
Application Number:
PCT/JP2020/019040
Publication Date:
November 26, 2020
Filing Date:
May 13, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D21/12; C25D7/12; C25D17/00; C25D17/12; H01L21/3205; H01L21/768; H01L23/522
Foreign References:
| JP2003073889A | 2003-03-12 | |||
| JP2007262448A | 2007-10-11 | |||
| JP2014201835A | 2014-10-27 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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