Title:
PLATING METHOD, LIGHT-TRANSMITTING CONDUCTIVE FILM AND ELECTROMAGNETIC SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2006/098336
Kind Code:
A1
Abstract:
Disclosed is a plating method for electrolytically plating a film surface having a surface resistance of from 1 &ohm /&square to 1000 &ohm /&square continuously. This plating method is characterized in that the distance from the lowest portion of the film surface which is in contact with a cathode to the surface of the plating solution is not less than 0.5 cm but not more than 15 cm.
Inventors:
MATSUMOTO JUN
Application Number:
PCT/JP2006/305057
Publication Date:
September 21, 2006
Filing Date:
March 14, 2006
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD (JP)
MATSUMOTO JUN
MATSUMOTO JUN
International Classes:
C25D7/06; C25D5/56; C25D7/00; H05K9/00
Domestic Patent References:
| WO2004007810A1 | 2004-01-22 |
Attorney, Agent or Firm:
Oguri, Shohei (7-13 Nishi-Shimbashi 1-chom, Minato-ku Tokyo, JP)
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