Title:
PLATING METHOD AND SUBSTRATE HOLDER OPERATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/123681
Kind Code:
A1
Abstract:
The present invention achieves a substrate holder with high substrate holding reliability. According to the present invention, a plating module includes a plating tank for containing a plating solution, a substrate holder 440 for holding a substrate while a surface to be plated faces downward, and a raising/lowering mechanism for raising/lowering the substrate holder 440. The substrate holder 440 includes: a support mechanism 460 for supporting an outer circumferential part of a surface Wf-a to be plated of a substrate Wf; a floating plate 472 disposed on the rear side of the surface Wf-a to be plated of the substrate Wf; a floating mechanism 490 for urging the floating plate 472 in a direction away from the rear surface of the substrate Wf; and a pressing mechanism 480 for pressing the floating plate 472 against the rear surface of the substrate Wf in resistance to the urging force produced by the floating mechanism 490 on the substrate Wf.
Inventors:
TOMITA MASAKI (JP)
SEKI MASAYA (JP)
SEKI MASAYA (JP)
Application Number:
PCT/JP2020/045825
Publication Date:
June 16, 2022
Filing Date:
December 09, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D7/12; C25D17/06
Foreign References:
| JP2003501550A | 2003-01-14 | |||
| JP2014051697A | 2014-03-20 | |||
| JP2018003085A | 2018-01-11 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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