Title:
PLATING SOLUTION FOR ELECTROPLATING GOLD ON NICKEL PLATING, METHOD FOR ELECTROPLATING GOLD ON NICKEL PLATING, AND GOLD-PLATED ITEM
Document Type and Number:
WIPO Patent Application WO/2023/050980
Kind Code:
A1
Abstract:
The present invention relates to the field of electroplating gold on nickel plating, and disclosed are a plating solution for electroplating gold on nickel plating, a method for electroplating gold on nickel plating, and a gold-plated article. The plating solution comprises a gold source, an electrically conductive salt and an organic phosphonic acid. When electroplating gold on a nickel plating, the organic phosphonic acid can selectively adsorb on the nickel surface to form a barrier layer, effectively inhibiting substitution between nickel and gold, and thereby achieving the preparation of a gold-plated layer having a uniform appearance and excellent bonding force by means of cyanide-free electroplating.
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Inventors:
REN CHANGYOU (CN)
WANG TONG (CN)
WANG TONG (CN)
Application Number:
PCT/CN2022/106798
Publication Date:
April 06, 2023
Filing Date:
July 20, 2022
Export Citation:
Assignee:
SHENZHEN UNITED BLUE OCEAN GOLD MATERIAL TECH CO LTD (CN)
HUAWEI TECH CO LTD (CN)
HUAWEI TECH CO LTD (CN)
International Classes:
C25D3/48; C25D5/12
Foreign References:
| CN113832509A | 2021-12-24 | |||
| CN113832508A | 2021-12-24 | |||
| CN114717618A | 2022-07-08 | |||
| CN114892225A | 2022-08-12 | |||
| CN114934302A | 2022-08-23 | |||
| CN112080769A | 2020-12-15 | |||
| CN111364074A | 2020-07-03 | |||
| CN101899688A | 2010-12-01 | |||
| CN105112953A | 2015-12-02 |
Attorney, Agent or Firm:
RUNPING & PARTNERS (CN)
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