Title:
PLATING TREATMENT TOOL AND PLATING TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/083914
Kind Code:
A1
Abstract:
[Problem] to provide a plating treatment tool and a plating treatment device in which it is possible to suppress the occurrence of nodules even when the plating treatment tool rotates in a plating bath. [Solution] This plating treatment tool is used for immersing a disk-shaped substrate having a central hole in a plating liquid within a plating bath, wherein the plating treatment tool is characterized by including a support rod inserted through the central hole in the substrate, a restricting member provided with a rotation-suppressing mechanism that supports the support rod and suppresses rotation of the supported support rod, and a carousel to which the support rod is attached with the restricting member interposed therebetween.
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Inventors:
FUJII TORU (JP)
SAMURA MAKI (JP)
NISHIZAKI TSUTOMU (JP)
SIIGI MASAHIRO (JP)
YAMAMOTO YASUO (JP)
SAMURA MAKI (JP)
NISHIZAKI TSUTOMU (JP)
SIIGI MASAHIRO (JP)
YAMAMOTO YASUO (JP)
Application Number:
PCT/JP2017/034832
Publication Date:
May 11, 2018
Filing Date:
September 27, 2017
Export Citation:
Assignee:
KOHAN KOGYO CO LTD (JP)
International Classes:
C23C18/31; G11B5/84
Foreign References:
| JP2011231347A | 2011-11-17 | |||
| JPS6233776A | 1987-02-13 | |||
| JP2001003177A | 2001-01-09 | |||
| JPH11256347A | 1999-09-21 | |||
| JPH0841649A | 1996-02-13 |
Attorney, Agent or Firm:
OHTA PATENT OFFICE (JP)
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