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Patent Searching and Data


Title:
PLUG-IN LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/041015
Kind Code:
A1
Abstract:
Provided is a flip chip plug-in light emitting diode chip structure with a circuit design of plug-in encapsulation manner. The plug-in light emitting diode chip structure (100) includes: a light emitting epitaxial structure including from bottom to top a second semiconductor layer (120), an active layer (130) and a first semiconductor layer (140); at least one first electrode (171) located on the first semiconductor layer (140), at least one second electrode (172) located on the second semiconductor layer (120), with the first electrode (171) and the second electrode (172) located on the same side of the light emitting epitaxial structure; at least two PIN pins (191, 192) respectively located on the first electrode (171) and the second electrode (172), wherein when the chip (100) is installed on a substrate with a corresponding jack, detachable connection can be realized through PIN pins (191, 192).

Inventors:
HUANG SHAOHUA (CN)
WU JYH-CHIARNG (CN)
Application Number:
CN2012/081565
Publication Date:
March 28, 2013
Filing Date:
September 19, 2012
Export Citation:
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Assignee:
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD (361009, CN)
International Classes:
H01L33/38; H01L33/62
Foreign References:
JP4778107B12011-09-21
CN102299228A2011-12-28
US20060102915A12006-05-18
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Claims: