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Patent Searching and Data


Title:
POLING TREATMENT METHOD, PLASMA POLING DEVICE, PIEZOELECTRIC SUBSTANCE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2012/014278
Kind Code:
A1
Abstract:
A plasma poling device capable of performing poling treatment easily by a dry process is provided. The plasma poling device is characterized by being provided with a holding electrode (4) which is disposed in a poling chamber (1) and holds a substrate to be subjected to poling (2) thereon, an opposite electrode (7) which is disposed in the poling chamber and disposed opposite the substrate to be subjected to poling held on the holding electrode, a power source (6) which is electrically connected to either the holding electrode or the opposite electrode, a gas supply mechanism which supplies gas for forming plasma to a space between the opposite electrode and the holding electrode, and a control unit which controls the power source and the gas supply mechanism, the control unit controlling the power source and the gas supply mechanism such that the plasma is formed at a position opposite to the substrate to be subjected to poling to perform poling treatment on the substrate to be subjected to poling.

Inventors:
HONDA YUUJI (JP)
KIJIMA TAKESHI (JP)
ABE KOJI (JP)
Application Number:
PCT/JP2010/062599
Publication Date:
February 02, 2012
Filing Date:
July 27, 2010
Export Citation:
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Assignee:
YOUTEC CO LTD (JP)
HONDA YUUJI (JP)
KIJIMA TAKESHI (JP)
ABE KOJI (JP)
International Classes:
C30B29/32; C30B33/12
Foreign References:
JP2005262108A2005-09-29
JP2007121933A2007-05-17
JP2000507392A2000-06-13
JP2000115895A2000-04-21
Attorney, Agent or Firm:
YANASE Mutsuyasu et al. (JP)
Mutsuyasu Yanase (JP)
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Claims: