Title:
POLISHED POLYIMIDE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO2004099826
Kind Code:
A3
Abstract:
Polymer substrates(96), in particular polyimide substrates, and polymer laminates for optical applications are described. Polyimide substrates are polished to an average surface roughness of about 0.25 µinch, and single-layer or multi-layer waveguide structures are deposited on the polished polyimide substrates. Laminates(90) including polymer or a hybrid organic/inorganic waveguiding film can be deposited on a polished polyimide substrate. The laminate can also include piezoelectric and metallic layers. Micromachined optical devices(95), such as cantilevered waveguide are fabricated by laser ablation using a combination of IR and UV lasers. A fiber-to-waveguide coupler with a laser-machined groove for holding the fiber is also disclosed.
Inventors:
FARAH JOHN (US)
Application Number:
PCT/US2004/013493
Publication Date:
July 14, 2005
Filing Date:
May 03, 2004
Export Citation:
Assignee:
FARAH JOHN (US)
International Classes:
G02B6/138; G02B6/30; G02B6/36; G02B6/12; H05K1/02; (IPC1-7): G02B6/10
Foreign References:
US5327512A | 1994-07-05 | |||
US5943464A | 1999-08-24 | |||
US6177151B1 | 2001-01-23 | |||
US6208791B1 | 2001-03-27 |
Download PDF:
Previous Patent: PHASE RETARDANCE AUTOSTEREOSCOPIC DISPLAY
Next Patent: GIMBAL ASSEMBLY FOR OPTICAL IMAGING SYSTEM
Next Patent: GIMBAL ASSEMBLY FOR OPTICAL IMAGING SYSTEM