Title:
POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2011/077973
Kind Code:
A1
Abstract:
Provided is a polishing agent for copper polishing that includes: at least one leveling agent selected from the group consisting of tetrazole, tetrazole derivatives, triazole, and triazole derivatives (with the exception of benzotriazole and benzotriazole derivatives); inorganic acid; amino acid, protective film-forming agent; abrasive grains; oxidant; and water. The inorganic acid content is 0.080 mol/kg or greater, the amino acid content is 0.200 mol/kg or greater, the protective film-forming agent content is 0.020 mol/kg or greater, and the ratio of the inorganic acid to the protective film-forming agent content is 3.0 or greater.
Inventors:
ONO Hiroshi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
SHINODA Takashi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
SHINODA Takashi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
Application Number:
JP2010/072250
Publication Date:
June 30, 2011
Filing Date:
December 10, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
ONO Hiroshi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
ONO Hiroshi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
International Classes:
H01L21/304; B24B37/04
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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