Title:
POLISHING AGENT, POLISHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/122415
Kind Code:
A1
Abstract:
Disclosed is a polishing agent for chemical mechanical polishing of a surface to be polished including surfaces comprising silicon oxide and surfaces comprising metal, wherein the polishing agent contains cerium oxide particles, a complexing agent, and water.
Inventors:
SUZUKI Masaru (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
Application Number:
JP2011/056979
Publication Date:
October 06, 2011
Filing Date:
March 23, 2011
Export Citation:
Assignee:
Asahi Glass Company, Limited. (12-1, Yurakucho 1-chome Chiyoda-k, Tokyo 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区有楽町一丁目１２番１号 Tokyo, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区有楽町一丁目１２番１号 Tokyo, 〒1008405, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims: