Title:
POLISHING AGENT AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/005142
Kind Code:
A1
Abstract:
Disclosed is a polishing agent (5) for polishing a surface to be polished of a polishing object (1), which contains first silicon oxide particles having an average primary particle diameter of 5-20 nm, second silicon oxide particles having an average primary particle diameter of 40-110 nm, and water. The ratio of the first silicon oxide particles relative to the total of the first silicon oxide particles and the second silicon oxide particles is 0.7-30% by mass.
Inventors:
YOSHINO Yuiko (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
Application Number:
JP2011/064786
Publication Date:
January 12, 2012
Filing Date:
June 28, 2011
Export Citation:
Assignee:
Asahi Glass Company, Limited. (5-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F7-13, Nishi-Shimbashi 1-chom, Minato-ku Tokyo 03, 〒1050003, JP)
Claims:
Previous Patent: ADJUSTMENT METHOD OF IMAGING DEVICE AND IMAGING DEVICE
Next Patent: METHOD FOR DEMAGNETIZING MAGNETIC POWDER
Next Patent: METHOD FOR DEMAGNETIZING MAGNETIC POWDER