Title:
POLISHING AGENT AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/005142
Kind Code:
A1
Abstract:
Disclosed is a polishing agent (5) for polishing a surface to be polished of a polishing object (1), which contains first silicon oxide particles having an average primary particle diameter of 5-20 nm, second silicon oxide particles having an average primary particle diameter of 40-110 nm, and water. The ratio of the first silicon oxide particles relative to the total of the first silicon oxide particles and the second silicon oxide particles is 0.7-30% by mass.
Inventors:
YOSHINO YUIKO (JP)
Application Number:
PCT/JP2011/064786
Publication Date:
January 12, 2012
Filing Date:
June 28, 2011
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
YOSHINO YUIKO (JP)
YOSHINO YUIKO (JP)
International Classes:
B24B37/00; H01L21/304; C09K3/14
Foreign References:
| JP2010042509A | 2010-02-25 | |||
| JP2008131001A | 2008-06-05 | |||
| JP2009238891A | 2009-10-15 | |||
| JP2008192656A | 2008-08-21 | |||
| JP2008163054A | 2008-07-17 | |||
| JP4253141B2 | 2009-04-08 |
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
Shohei Oguri (JP)
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Claims:
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