Title:
POLISHING AGENT, MULTI-LIQUID POLISHING AGENT, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/107217
Kind Code:
A1
Abstract:
Provided is a polishing agent for use in polishing a polishing target surface including cobalt, said polishing agent comprising abrasive grains, quaternary phosphonium salt, and water, and having a pH greater than 4.0. Also provided is a multi-liquid polishing agent for obtaining said polishing agent, said multi-liquid polishing agent comprising at least a first liquid containing the abrasive grains, and a second liquid containing the quaternary phosphonium salt. Also provided is a polishing method in which said polishing agent or a polishing agent obtained from said multi-liquid polishing agent is used to polish a polishing target surface including cobalt.
Inventors:
KAWAKITA JUNPEI (JP)
HANANO MASAYUKI (JP)
SAKASHITA MASAHIRO (JP)
KANEHIRA KOJI (JP)
HANANO MASAYUKI (JP)
SAKASHITA MASAHIRO (JP)
KANEHIRA KOJI (JP)
Application Number:
PCT/JP2020/042834
Publication Date:
May 27, 2022
Filing Date:
November 17, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2014007063A1 | 2014-01-09 |
Foreign References:
| JP2013120885A | 2013-06-17 | |||
| JP2020174176A | 2020-10-22 | |||
| JP2019520697A | 2019-07-18 | |||
| JP2015189829A | 2015-11-02 | |||
| JP2012015352A | 2012-01-19 | |||
| JP2017157591A | 2017-09-07 | |||
| US20130186850A1 | 2013-07-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: