Title:
POLISHING AGENT, POLISHING AGENT SET AND METHOD FOR POLISHING BASE
Document Type and Number:
WIPO Patent Application WO/2015/052988
Kind Code:
A1
Abstract:
A polishing agent which contains water, abrasive grains containing a hydroxide of a tetravalent metal element, a polymerization product of α-glucose and a cationic polymer, and wherein the polymerization product of α-glucose has a weight average molecular weight of 20.0 × 103 or less.
Inventors:
IWANO TOMOHIRO (JP)
KIKKAWA CHISATO (JP)
AKUTSU TOSHIAKI (JP)
MINAMI HISATAKA (JP)
KIKKAWA CHISATO (JP)
AKUTSU TOSHIAKI (JP)
MINAMI HISATAKA (JP)
Application Number:
PCT/JP2014/071232
Publication Date:
April 16, 2015
Filing Date:
August 11, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2013125441A1 | 2013-08-29 | |||
| WO2013125446A1 | 2013-08-29 | |||
| WO2012123839A1 | 2012-09-20 |
Foreign References:
| JP2013145877A | 2013-07-25 | |||
| JP2011103410A | 2011-05-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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