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Title:
POLISHING AGENT, STOCK SOLUTION FOR POLISHING AGENT, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/168534
Kind Code:
A1
Abstract:
A polishing agent containing abrasive grains and water, wherein the abrasive grains include silica particles, the average grain size Rave of the abrasive grains is 50 nm or higher, the ratio Rave/Rmin of the average grain size Rave with respect to the average minor axis Rmin of the abrasive grains is 1.0-2.0, and the zeta potential of the abrasive grains in the polishing agent is positive.

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Inventors:
HANANO MASAYUKI (JP)
MISHIMA KOUJI (JP)
WATANABE NAOMI (JP)
Application Number:
PCT/JP2018/008133
Publication Date:
September 20, 2018
Filing Date:
March 02, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2011021599A12011-02-24
WO2015200660A12015-12-30
WO2016158324A12016-10-06
WO2012102187A12012-08-02
Foreign References:
JP2014022511A2014-02-03
JP2015189898A2015-11-02
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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