Title:
POLISHING-AMOUNT SIMULATION METHOD FOR BUFFING PROCESS, AND BUFFING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/117485
Kind Code:
A1
Abstract:
One problem addressed by the invention of the present application is to perform a buffing-amount simulation that considers the pressure concentration that is generated in the vicinity of the edge of a substrate to be polished when a small-diameter buffing pad overhangs the substrate. One embodiment of the invention of the present application provides a method for simulating polishing amount for situations in which a polishing pad that is smaller than a polishing target is used to buff the polishing target. The simulation method has: a step for using a pressure sensor to measure the pressure distribution applied to the polishing target by the polishing pad in accordance with the amount that the polishing pad overhangs the polishing target; and a step for correcting the pressure used in the polishing-amount simulation on the basis of the overhang amount and the measured pressure distribution.
Inventors:
YAMAGUCHI KUNIAKI (JP)
KOBATA ITSUKI (JP)
MIZUNO TOSHIO (JP)
KOBATA ITSUKI (JP)
MIZUNO TOSHIO (JP)
Application Number:
PCT/JP2016/051206
Publication Date:
July 28, 2016
Filing Date:
January 18, 2016
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/34; B24B37/10; H01L21/304
Foreign References:
| JP2001244222A | 2001-09-07 | |||
| JP2001269861A | 2001-10-02 | |||
| JP2011083856A | 2011-04-28 | |||
| JP2010076049A | 2010-04-08 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
Ono Shinjiro (JP)
Ono Shinjiro (JP)
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