POLISHING APPARATUS AND METHOD OF DRESSING POLISHING TOOL

WIPO Patent Application WO/2004/007146

A1

In a polishing apparatus (201), a polishing tool including abrasive and binder for binding the abrasive is pressed to a substrate (W) held by a top ring (21) and polishes the substrate (W). The polishing apparatus (201) comprises a light source (31) for radiating light rays to a polishing face (15) so as to reduce binding force of the binder that binds abrasive, and a foreign object removing mechanism (32) for forcibly removing foreign objects produced in polishing or foreign objects produced by the radiation. With the structure above, dressing of the polishing face (15) is performed by radiating light rays to the polishing face, and products etc. produced by the dressing are removed. The dressing enables the polishing apparatus (201) to stably supply abrasive to the polishing face and high-speed polishing of the substrate (W).

KOJIMA SHUNICHIRO (JP)
HIROKAWA KAZUTO (JP)
KODERA AKIRA (JP)

PCT/JP2003/008766

January 22, 2004

July 10, 2003

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EBARA CORP (JP)
KOJIMA SHUNICHIRO (JP)
HIROKAWA KAZUTO (JP)
KODERA AKIRA (JP)

B24B53/00; B24B53/007; B24B53/02; B24D3/34; H01L21/304; (IPC1-7): B24B53/00

WO1999012705A1	1999-03-18
WO2002034467A1	2002-05-02
WO2000024548A1	2000-05-04

JP2001129755A	2001-05-15
JPS58191956U	1983-12-20
JPS58132462A	1983-08-06
JP2000254855A	2000-09-19
JP2001237208A	2001-08-31
JPS62136370A	1987-06-19
JPH09323259A	1997-12-16
JP2000311876A	2000-11-07
JP2002103201A	2002-04-09
US6217422B1	2001-04-17
JP2002324771A	2002-11-08

Shamoto, Ichio (Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)

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