Title:
POLISHING APPARATUS AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/001710
Kind Code:
A1
Abstract:
Provided is a polishing apparatus that can efficiently correct protruding defects on the surface of a workpiece. A tape polishing apparatus (1) that corrects protruding defects on the surface of a workpiece with a running polishing tape includes: a feeding reel (23) having polishing tape; a take-up reel (24) that winds the polishing tape; a polishing head that is positioned between the feeding reel (23) and the take-up reel (24) and presses the polishing tape against the workpiece; a control unit (34) that controls the running of the polishing tape in the forward direction in which the polishing tape goes from the feeding reel (23) to the take-up reel (24) and in the direction opposite to the forward direction; a detecting unit (36) that detects whether or not protruding defects have been removed by the polishing tape running in the forward direction and in the reverse direction, and a determining unit (38) that determines, on the basis of the detected result at the detecting unit (36), whether protruding defects are to be polished and removed with the polishing tape.
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Inventors:
SATOH, Hitoshi (())
Application Number:
JP2010/053521
Publication Date:
January 06, 2011
Filing Date:
March 04, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
B24B21/00; B24B27/033
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (Fukami Patent Office, Nakanoshima Central Tower 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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