Title:
POLISHING APPARATUS AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/211736
Kind Code:
A1
Abstract:
The present invention relates to a polishing apparatus and a polishing method, for pressing a polishing tool against the peripheral edge part of a substrate and polishing the peripheral edge part. The polishing apparatus is provided with a substrate retaining part (3) for retaining a substrate (W), a polishing head (50) for pressing a polishing tool (38) against the substrate (W), a support structure (24) for supporting the polishing head (50), a base structure (23) to which the support structure (24) is fixed, and a reinforcing structure (110) fixed to the support structure (24). The reinforcing structure (110) has an anchor mechanism (112) configured so as to be fixable to and detachable from the base structure (23).
Inventors:
KASHIWAGI MAKOTO (JP)
YOSHIDA ATSUSHI (JP)
DU FONG-JIE (JP)
YAMASHITA MICHIYOSHI (JP)
YOSHIDA ATSUSHI (JP)
DU FONG-JIE (JP)
YAMASHITA MICHIYOSHI (JP)
Application Number:
PCT/JP2018/000092
Publication Date:
November 22, 2018
Filing Date:
January 05, 2018
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B41/02; B24B21/00; B24B49/08; B24B55/00; H01L21/304
Foreign References:
| JPH09155725A | 1997-06-17 | |||
| JP2012213849A | 2012-11-08 | |||
| JP2014150131A | 2014-08-21 | |||
| JP2002143535A | 2002-05-21 | |||
| JPH11198026A | 1999-07-27 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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