POLISHING APPARATUS AND POLISHING METHOD

WIPO Patent Application WO/2022/091532

A1

The present invention provides technology that enables accurate measuring of the polishing state of a substrate.　A polishing device 100 comprises: a sensor head 40 having a light projector for projecting incident light, a light collector for collecting the incident light projected from the light projector to cause the same to be incident on a substrate Wf, and a photodetector for receiving the reflected light reflected from the substrate; a displacement mechanism 60 for changing the distance between the light collector and the substrate by displacing the light collector relatively to the substrate; a wear amount measuring device 70 for measuring the wear amount of a polishing pad 90; and a control device 80, wherein the control device measures the polishing state of the substrate on the basis of a light amount parameter of the reflected light received by the photodetector and controls the displacement mechanism on the basis of the wear amount of the polishing pad measured by the wear amount measuring device such that the distance between the light collector and the substrate is kept to a reference distance set in advance.

YAZAWA AKIHIRO (JP)
MIYASAWA YASUYUKI (JP)

PCT/JP2021/030352

May 05, 2022

August 19, 2021

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EBARA CORP (JP)

B24B37/013; B24B49/10; B24B49/12; H01L21/304

JPH10229060A	1998-08-25
JP2000223451A	2000-08-11
JP2020053550A	2020-04-02
JP2020183554A	2020-11-12
JPH10229060A	1998-08-25
JP2001235311A	2001-08-31
JP2020019115A	2020-02-06

MIYAMAE, Toru et al. (JP)

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