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Patent Searching and Data


Title:
POLISHING APPARATUS AND WAFER POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/037878
Kind Code:
A1
Abstract:
The present invention is a polishing apparatus comprising: a surface plate to which a polishing cloth for polishing a wafer is attached; and a plurality of polishing heads that are rotatable while holding the wafer and are capable of pressing the wafer to the polishing cloth while applying a polishing load to the wafer, wherein, while the polishing heads are rotated, the wafer held by the polishing heads is pressed to the polishing cloth so as to be polished. This polishing apparatus is characterized in that each of the plurality of polishing heads individually has: a pressure control mechanism that controls the polishing load of the polishing head; and a rotation control mechanism that controls the rotation speed of the polishing head. Accordingly, provided are a wafer polishing method and a polishing apparatus capable of reducing variation in machining allowance and machining allowance distribution among the polishing heads.

Inventors:
UENO Junichi (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
ISHII Kaoru (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2017/028331
Publication Date:
March 01, 2018
Filing Date:
August 04, 2017
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO.,LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
H01L21/304; B24B37/30
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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