POLISHING APPARATUS

WIPO Patent Application WO/2004/043648

A1

A polishing apparatus, comprising a polished object holding mechanism for holding a polished object and a table having a polishing surface, wherein the polished object held by the polished object holding mechanism is pressed against the polishing surface of the table, and the polished object is polished by the relative motion of the polished object held by the polished object holding mechanism to the polishing surface of the table, and also an elastic body sheet (11) is stretched on the upper surface of the table and a polishing pad (16) having a polishing surface on the upper surface thereof is replaceably stretched on the elastic body sheet (11) to provide a function played by the lower pad of a double-layer polishing pad used in a chemical machine polishing (CMP) apparatus to the table of the chemical machine polishing (CMP) apparatus, whereby the cost of a chemical machine polishing (CMP) process can be lowered, and a process performance such as the uniformity of polishing speed on the surface of a polished substrate can be stabilized.

HIROSE MASAYOSHI (JP)
YASUDA HOZUMI (JP)
HIROKAWA KAZUTO (JP)
NOJI IKUTARO (JP)

PCT/JP2003/013628

May 27, 2004

October 24, 2003

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EBARA CORP (JP)
HIROSE MASAYOSHI (JP)
YASUDA HOZUMI (JP)
HIROKAWA KAZUTO (JP)
NOJI IKUTARO (JP)

B24B37/12; B24D9/08; B24D13/14; H01L21/304; (IPC1-7): B24B37/04

JPH10156705A	1998-06-16
JPH0997772A	1997-04-08
JPH05285825A	1993-11-02
JPH106207A	1998-01-13
JP2002246346A	2002-08-30
JP2001071250A	2001-03-21

Shamoto, Ichio (Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)

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