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Patent Searching and Data


Title:
POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2004/096492
Kind Code:
A1
Abstract:
A polishing apparatus for polishing a surface of an object such as a semiconductor wafer smooth is disclosed. The polishing apparatus comprises a polishing tool which is fixed by creating a vacuum in a fluid channel which has an opening in the upper surface of a polishing table. The polishing tool comprises a polishing pad and a base made of a resin or a metal on which the polishing pad is mounted, and is divided into a plurality of parts. The polishing pad and the base are made of the same material.

Inventors:
NAGAI SATOSHI (JP)
Application Number:
PCT/JP2004/006138
Publication Date:
November 11, 2004
Filing Date:
April 28, 2004
Export Citation:
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Assignee:
EBARA CORP (JP)
NAGAI SATOSHI (JP)
International Classes:
B24B37/12; B24B37/20; B24B37/24; B24B41/047; B24D7/06; H01L21/304; (IPC1-7): B24B37/04; B24B41/047; H01L21/304
Foreign References:
JPH106209A1998-01-13
JP2002103262A2002-04-09
JP2002110598A2002-04-12
Attorney, Agent or Firm:
Watanabe, Isamu (5-8 Nishi-Shinjuku 7-chom, Shinjuku-ku Tokyo 23, JP)
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