Title:
POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2006/126455
Kind Code:
A1
Abstract:
A polishing apparatus exhibiting extremely excellent practicality in which good polishing can be ensured even if a pattern or a tin film composed of a soft material or a material of low hardness is formed on the surface of a substrate. The apparatus for polishing the surface of a substrate (1) comprises a polishing head (P) provided with a polishing material where a large number of flexible hairlike bodies (32) integrating abrasive grains (31) are formed on a base plane (33). The polishing apparatus is arranged to sharpen the surface of the substrate (1) with the hairlike bodies (32) integrating the abrasive grains (31) by oscillating the polishing material or the substrate (1) while touching the polishing material in the polishing head P to the surface of the substrate (1). The hairlike bodies (32) have a length and flexibility set such that the polishing material can polish not only the top face of protrusions but also the bottom face of recesses when the polishing material is touched to the surface of the substrate (1) having protrusions and recesses.
Inventors:
UJIHARA TAKASHI (JP)
Application Number:
PCT/JP2006/310017
Publication Date:
November 30, 2006
Filing Date:
May 19, 2006
Export Citation:
Assignee:
TOKKI KK (JP)
UJIHARA TAKASHI (JP)
UJIHARA TAKASHI (JP)
International Classes:
B24B21/00; B24B29/00; B24D3/00; B24D11/00
Foreign References:
| JP2004322305A | 2004-11-18 | |||
| JPH07276247A | 1995-10-24 |
Attorney, Agent or Firm:
Yoshii, Takeshi (Nagaoka-shi Niigata, 61, JP)
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