POLISHING BODY, POLISHING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2004/001829

A1

A polishing body (4) installed on a base material (5), comprising a polishing pad (6), a hard elastic member (7), and a soft member (8) stacked in this order from a polishing surface side, wherein, for example, a Rodel-nitta Co., Ltd.-make IC1000 (brand name) is used as the polishing pad (6), for example, a stainless steel sheet is used as the hard elastic member (7), and a * a Rodel-nitta Co., Ltd.-make Suba400 (brand name) is used as the soft member (8), a groove (6a) is provided in the polishing pad (6) on the polishing surface side, and the remaining thickness (d) of the polishing pad (6) at the position of the groove (6a) is set so as to meet the requirement of 0 mm < d ≤ 0.6 mm, whereby 'local pattern flatness' can be increased by increasing a step eliminating capability while assuring 'global removal uniformity', and the service life of the polishing body can be increased.

JP2900777	[Title of Invention] Polishing member and wafer polishing device
JP4493094	Substrate continuous manufacturing method
JP4926746	Polishing pad grooving machine and polishing pad grooving method

HOSHINO SUSUMU (JP)
SUGAYA ISAO (JP)

PCT/JP2003/007854

December 31, 2003

June 20, 2003

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NIKON CORP (JP)
HOSHINO SUSUMU (JP)
SUGAYA ISAO (JP)

B24B37/20; B24B37/22; B24B37/26; B24D13/14; H01L21/304; (IPC1-7): H01L21/304

WO2000012642A1

2000-03-09

JP2002075933A	2002-03-15
JP2001121405A	2001-05-08
JP2002028849A	2002-01-29
JP2001277102A	2001-10-09
JPH11156701A	1999-06-15

Hosoe, Toshiaki (3-6 Nishikanagawa 1-Chome, Kanagawa-k, Yokohama-Shi Kanagawa, JP)

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